06809 瀾起科技
MONTAGE TECH
MONTAGE TECH
| Register Close | 2026/02/04 IPO Closing in 5 Days |
| Listing Date | 2026/02/09 |
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IPO Detail
COMPANY PROFILE
Montage Technology Co. is a leading global fabless IC design company focused on offering innovative, reliable and power-efficient interconnect solutions for cloud computing and AI infrastructure.
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The Group provides interconnect chips including memory interconnect chips and PCIe/CXL interconnect chips to industry leading customers for a wide range of end applications in data centers, servers and computers. In terms of revenue in 2024, the Group has emerged as the largest memory interconnect chip supplier in the world, with 36.8% market share, according to the report.
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The Group provides a full range of DDR2 to DDR5 (the second to the fifths generations of double data rate technologies) memory interface chips together with DDR5 supporting chips including SPD (Serial Presence Detect), TS (Temperature Sensor), and PMIC (Power Management Integrated Circuit) chips.
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The Group primarily derived its revenue from sales of interconnect chips and Jintide products, and its customers primarily included memory module manufacturers, server OEM/ODMs and cloud service providers (CSPs).
BASIC INFORMATION
| Market | Hong Kong (Main Board) |
| Business Nature | Software & Services |
| Major Business Area | China |
| Board Lot | 100 |
GLOBAL OFFERING
| No. of Offer Shares | 65.89M H shares |
| No. of International Offer Shares | 59.30M H shares |
| No. of HK Offer Shares | 6.59M H shares |
| Offer Price | $106.89 |
| Stock Code | 6809 |
| Sponsor(s) | China International Capital Corporation Hong Kong Securities Limited, Morgan Stanley Asia Limited, UBS Securities Hong Kong Limited, UBS AG Hong Kong Branch |
| Underwriter(s) | China International Capital Corporation Hong Kong Securities Limited, Morgan Stanley Asia Limited, UBS AG Hong Kong Branch, Goldman Sachs (Asia) L.L.C., CLSA Limited |
TIME TABLE
| Application Period | Jan 30 (Fri) - noon, Feb 04 (Wed) |
| Price Determination Date | Feb 05 (Thu) |
| Result Announcement Date | On or before Feb 06 (Fri) |
| Result Announcement Date | On or before Feb 06 (Fri) |
| Result Announcement Date | On or before Feb 09 (Mon) |
| Dealings in Shares commence on | Feb 09, 2026. (Mon) |
Reallocation of Shares Offered
Sales Statistics (HKD)
| Offer Price | $106.89 |
| Capitalization (H Shares) | 7.04B |
| NAV / share ($) | $16.93 (Unaudited pro forma adj NAV / share) |
Use Of Proceeds
| Assuming the offer price being at HKD 106.89, the net proceeds raised would be HKD 6.90B, of which |
| 70% : Invest in R&D in interconnect chip domain |
| 5% : Enhance commercialization capabilities |
| 15% : Strategic investments and/or acquisitions |
| 10% : Working capital |
Related Document
| Prospectus |  Chinese Version | English Version |
| Remark： | The above information is referenced from the prospectus. |
| All data is calculated from the non- exercise rights(if applicable). |
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*Admission fees include brokerage of 1%, SFC transaction levy of 0.0027%, Stock Exchange trading fee of 0.005% and FRC transaction levy of 0.00015% (i.e. 1.0077% in total).