CFMEE
| Register Close | 2026/06/23 IPO Closing in 5 Days |
| Listing Date | 2026/06/26 |
| Register Close | 2026/06/23 IPO Closing in 5 Days |
| Listing Date | 2026/06/26 |
Circuit Fabology Microelectronics Equipment Co. is the largest provider of PCB direct imaging equipment globally, delivering PCB direct imaging equipment and semiconductor direct-writing lithography equipment in the age of AI.
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The Group’s main products include PCB direct imaging equipment and automation system; semiconductor direct-writing lithography equipment and automation system; and comprehensive after-sales maintenance and support services of the above products; its customers were mainly PCB and semiconductor manufacturers, while a small proportion of its customers were distributors.
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According to the report, the Group ranked fourth among global direct-writing lithography equipment suppliers, with a market share of 9.4% by revenue in 2025, and it is the largest provider of PCB direct imaging equipment globally, with a market share of 18.8% by revenue in 2025.
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As of June 8, 2026, the Group had one production base in Hefei, China, comprising Phase I and Phase II. The Hefei Production Base (Phase I) commenced operations in 2021 and specializes in production of high-end PCB direct imaging equipment, wafer-level packaging direct imaging lithography equipment and FPD equipment. The Hefei Production Base (Phase II) commenced initial trial operation in September 2025 and specializes in the production of automation system, high-end PCB direct imaging equipment, laser drilling equipment, wafer-level packaging direct imaging lithography equipment and FPD equipment. It produced 48 automated production lines to support 96 LDI units as of December 31, 2025.
| Market | Hong Kong (Main Board) |
| Business Nature | IT Hardware |
| Major Business Area | China |
| Board Lot | 50 |
| No. of Offer Shares | 12.84M H shares |
| No. of International Offer Shares | 11.55M H shares |
| No. of HK Offer Shares | 1.28M H shares |
| Offer Price | $240.09 - $252.73 |
| Stock Code | 9630 |
| Sponsor(s) | China International Capital Corporation Hong Kong Securities Limited |
| Underwriter(s) | China International Capital Corporation Hong Kong Securities Limited, CMB International Capital Limited, Guoyuan Securities Brokerage (Hong Kong) Limited, BOCI Asia Limited, Futu Securities International (Hong Kong) Limited |
| Application Period | Jun 17 (Wed) - noon, Jun 23 (Tue) |
| Price Determination Date | Jun 24 (Wed) |
| Result Announcement Date | On or before Jun 25 (Thu) |
| Result Announcement Date | On or before Jun 25 (Thu) |
| Result Announcement Date | On or before Jun 26 (Fri) |
| Dealings in Shares commence on | Jun 26, 2026. (Fri) |
| Offer Price | $240.09 - $252.73 |
| Capitalization (H Shares) | 3.08B - 3.24B |
| NAV / share ($) | $39.01 - $40.11 (Unaudited pro forma adj NAV / share) |
| Assuming the offer price being at HKD 246.41, the net proceeds raised would be HKD 3.07B, of which |
| 25% : Strengthen research and development capabilities |
| 18% : Expand overall production capacity |
| 27% : Strategic investments and/or acquisitions |
| 20% : Expand international sales presence and develop overseas sales and service network |
| 10% : Working capital |
| Prospectus |
| Remark: | The above information is referenced from the prospectus. |
| All data is calculated from the non- exercise rights(if applicable). |
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